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High Precision ESD Safe JEDEC Tray for Fine Pitch IC with Automation Compatibility

High Precision ESD Safe JEDEC Tray for Fine Pitch IC with Automation Compatibility

Merknaam: Hiner-pack
Modelnummer: HN24239
MOQ: 500 STUKS
Prijs: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Betalingsvoorwaarden: T/T
Toeleveringsvermogen: 2000 stks/dag
Gedetailleerde informatie
Plaats van herkomst:
China
Certificering:
ROHS, ISO
Tray Weight:
Varieert, doorgaans tot 500 gram per holte
Kleur:
Meestal zwart of donkergrijs voor ESD-bescherming
Kwaliteitsborging:
Leveringsgarantie, betrouwbare kwaliteit
Grootte van de holte:
14x22x1,96mm
Incotermen:
EXW, FOB, CIF, DDU, DDP
Schimmeltype:
Injectie
Herbruikbaar:
Ja
Trayvorm:
Rechthoekig
Schone Klasse:
Het algemene en ultrasone schoonmaken
IC-type:
BGA,QFP,QFN,LGA,PGA
Verpakkingsniveau:
Transportpakket
Vlakheid:
Minder dan 0,76 mm
Capaciteit:
6x11=66 ST
Verpakking Details:
karton, pallet
Levering vermogen:
2000 stks/dag
Markeren:

ESD safe JEDEC IC tray

,

fine pitch IC storage tray

,

automation compatible JEDEC tray

Productbeschrijving
High Precision JEDEC Tray for Fine Pitch IC

This JEDEC tray is designed for delicate, fine pitch ICs, ensuring stable positioning during automated pick-and-place, inspection, and transport. Its high-precision cavity minimizes chip movement and reduces defects.

Key Features/ Benefits
  • High precision cavities for fine pitch IC (≤0.5 mm)
  • ESD safe with surface resistance 1E4–1E11 Ω
  • Compatible with automation handling systems
  • Custom pockets available for various IC types
  • Durable material for long lifecycle
Specifications
Brand Hiner-pack
Model HN24239
Material ABS
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 14x22x1.96 mm
Matrix QTY 6x11=66 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices

  • Fine pitch IC packaging (QFN, BGA, CSP)
  • Automated pick-and-place systems
  • Semiconductor inspection & testing
  • IC logistics and storage
Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:

Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers