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ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

Merknaam: Hiner-pack
Modelnummer: HN24175
MOQ: 500 STUKS
Prijs: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Betalingsvoorwaarden: T/T
Toeleveringsvermogen: 2000 stks/dag
Gedetailleerde informatie
Plaats van herkomst:
China
Certificering:
ROHS, ISO
Tray Weight:
Varieert, doorgaans tot 500 gram per holte
Kleur:
Zwart
Kwaliteitsborging:
Leveringsgarantie, betrouwbare kwaliteit
Omtreklijngrootte:
50,7×50,7×7,4 mm
Grootte van de holte:
1,30x1,15x0,72 mm
Incotermen:
EXW, FOB, CIF, DDU, DDP
Schimmeltype:
Injectie
Herbruikbaar:
Ja
Trayvorm:
Rechthoekig
Schone Klasse:
Het algemene en ultrasone schoonmaken
IC-type:
BGA,QFP,QFN,LGA,PGA
Verpakkingsniveau:
Transportpakket
Kromtrekken:
Vervorming MAX 0,2 mm
Capaciteit:
17x18=306 ST
Verpakking Details:
karton, pallet
Levering vermogen:
2000 stks/dag
Productbeschrijving
ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.


It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.


It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Withstands 125℃ high temperatures.
  • Offers secure IC chip storage.
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24175
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 1.30x1.15x0.72 mm
Matrix QTY 17x18=306 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
It applies to semiconductor encapsulation, IC testing, die sorting, and wafer processing. It adapts to high-precision manufacturing and cleanroom operations.


It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.

Packaging & Shipping/ Services
Custom cross-slot waffle tray services are available. Tailor cavity size, layout, and material for specific IC models. Create exclusive solutions to meet unique semiconductor packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers