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Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips

Merknaam:	Hiner-pack
Modelnummer:	HN24177
MOQ:	500 STUKS
Prijs:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Betalingsvoorwaarden:	T/T
Toeleveringsvermogen:	2000 stks/dag

Gedetailleerde informatie

Productbeschrijving

Gedetailleerde informatie

Plaats van herkomst:

China

Certificering:

ROHS, ISO

Tray Weight:

Varieert, doorgaans tot 500 gram per holte

Kleur:

Zwart

Kwaliteitsborging:

Leveringsgarantie, betrouwbare kwaliteit

Omtreklijngrootte:

50,7×50,7×7,4 mm

Grootte van de holte:

1,68x1,55x0,67 mm

Incotermen:

EXW, FOB, CIF, DDU, DDP

Schimmeltype:

Injectie

Herbruikbaar:

Trayvorm:

Rechthoekig

Schone Klasse:

Het algemene en ultrasone schoonmaken

IC-type:

BGA,QFP,QFN,LGA,PGA

Verpakkingsniveau:

Transportpakket

Kromtrekken:

Vervorming MAX 0,21 mm

Capaciteit:

16x17=272 ST

Verpakking Details:

karton, pallet

Levering vermogen:

2000 stks/dag

Markeren:

High-Temp Waffle Pack Tray

Durable IC Chip Tray

Precision Grid Design ESD Tray

Productbeschrijving

Durable High-Temp ESD Waffle Trays for IC Chips

Deliver precise grid structure to hold delicate IC components firmly, preventing shifting and damage during handling. Built with durable material for consistent performance in industrial environments. Offer reliable compatibility with semiconductor production workflows. Seeking high-density trays for secure component storage?

Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in component loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.

Support fully customized grid spacing and cavity dimensions to match specific component sizes. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect ICs throughout transit.

Key Features/ Benefits

Durable construction
Precision grid design
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24177
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×7.4 mm
Cavity Size		1.68x1.55x0.67 mm
Matrix QTY		16x17=272 PCS
Warpage		MAX 0.21mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Serve semiconductor IC packaging, cleanroom assembly, component sorting, and high-density storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.

Also utilized in inter-factory component transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.

Customized Services

Provide fully customized solutions for grid IC waffle trays. Adjust grid spacing, cavity size, and layout to fit diverse component dimensions.

Leverage durable material for enhanced stability. Offer prototype testing and personalized design support to meet unique production and packaging needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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